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Hudson-Sharp Exhibiting its Flexible Film Revolutions at Pack Expo 2017

July 10, 2017

Green Bay, Wisconsin (July, 10, 2017) - Hudson-Sharp will be attending Pack Expo 2017 in Las Vegas, NV., September 25-27.  Hudson Sharp, as well as its parent companies - Thiele Technologies and Barry-Wehmiller - will be located at the Barry-Wehmiller Company booth #C-1800. There will be professionals available to answer questions and discuss the latest developments in the company’s extensive list of products. 

New at the show this year, Hudson-Sharp's EZ-Stand flexible packaging will be running on a Hayssen Machine. Visistors will be able to see the fromation and filling of an EZ-Stand pouch.

 

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